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US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Semiconductor device and method of making" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,806, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "Semiconductor device and method of m... Read More


US Patent Issued to Sony Semiconductor Solutions on Aug. 4 for "Solid-state imaging device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,807, issued on Aug. 4, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Solid-state imaging device" was invented by Ta... Read More


US Patent Issued to Sony Semiconductor Solutions on Aug. 4 for "Solid-state imaging device, method of producing the same, and electronic apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,808, issued on Aug. 4, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Solid-state imaging device, method of producin... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor package including multiple semiconductor chips" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,809, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including multiple semic... Read More


US Patent Issued to Kioxia on Aug. 4 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,810, issued on Aug. 4, was assigned to Kioxia Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor device" was inv... Read More


US Patent Issued to Canon on Aug. 4 for "Photoelectric conversion device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,811, issued on Aug. 4, was assigned to Canon K.K. (Tokyo). "Photoelectric conversion device" was invented by Mahito Shinohara (Tokyo). Acco... Read More


US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Aug. 4 for "Light-receiving device, X-ray imaging device, and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,812, issued on Aug. 4, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan). "Light-receiving device, X-ray imaging device, ... Read More


US Patent Issued to Sony Semiconductor Solutions on Aug. 4 for "Semiconductor package" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,813, issued on Aug. 4, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Semiconductor package" was invented by Shun Mi... Read More


US Patent Issued to TIANMA JAPAN on Aug. 4 for "Imaging element and mother glass substrate" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,814, issued on Aug. 4, was assigned to TIANMA JAPAN LTD. (Kawasaki, Japan). "Imaging element and mother glass substrate" was invented by Hid... Read More


US Patent Issued to OLYMPUS MEDICAL SYSTEMS on Aug. 4 for "Electronic component device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,815, issued on Aug. 4, was assigned to OLYMPUS MEDICAL SYSTEMS CORP. (Tokyo). "Electronic component device" was invented by Junya Yamada (Ka... Read More